This product is a heat exchanger assembly consisting of number of folded fins between top plate and bottom plate. Through which mixture of ethylene glycol and water will be flowing with high pressure to remove the heat dissipated on the top plate by the electronic assembly by forced convection. This heat exchanger is used for the ground electronics in military warfare applications. Fins are attached with adhesive to top and bottom plates and need to study the de-bonding effect between these parts.
Simulating the de-bonding capacity which involves material non-linearity and contact non-linearity and several mesh convergence issues was a challenging task.
Scope of Work:
The Non-linear analysis was performed on heat exchanger with different pressure load cases as described below. The response of the structure is checked for each case.
Load Case1: Pressure load of 300psi , Load Case2: Pressure load of 650psi ,
Load Case3: Pressure load of 750psi, Load Case 4: Pressure load of 850psi.
Identifying peak pressure(750psi) by Simulating the de-bonding between the plates and fins of the heat exchanger.