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THERMAL FLOW ANALYSIS OF EA POD

THERMAL FLOW ANALYSIS OF EA POD

Introduction:

EA POD is an electronic enclosure used for defense applications, this is an electronic signal jammer assembly which jams the radar and different signals between any band widths of the frequency. This assembly needs to be optimistically designed for structural and thermal loads.

Electronic Cooling

Challenges:

Simulating the thermal flow analysis for EA POD assembly with many small sensitive electronic components and maintaining the temperatures below 50℃ by proper effective conduction and forced convection was a challenging task.

Scope of Work:

The thermal flow analysis was performed on the Electronic Pod Assembly. The assembly is analyzed taking forced convection and conduction into consideration.
The aim of the project is to maintain the temperature distribution inside Electronic assembly.
Case: Ambient Temperature 20℃ and Flow Rate of 32Lit/min 6.3KW internal wattage

Engineering Solution:

Max Solid temperature is 42.53℃ and max Fluid temperature is 42.53℃
Electronic Cooling

PRACTICAL TEST IMAGES AFTER MANUFACTURING :

thermaleapod-3

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